Semiconductors are the foundation of modern innovation, powering industries from automotive and aerospace to healthcare and digital technologies while enabling the global energy transition. Recent supply chain disruptions and geopolitical tensions have highlighted Europe's reliance on overseas semiconductor manufacturing, reinforcing the need for resilient, next-generation technologies.

Chiplet architectures are redefining the future of microelectronics. As traditional System-on-Chip (SoC) scaling approaches the physical limits of silicon (around 3 nm), the industry is shifting toward heterogeneous integration combining multiple chips made from different semiconductor materials, including Si, SiC, GaN, and GaAs, into a single high-performance package.

This "More than Moore" approach is driving a new era of System-in-Package (SiP) technology, where multiple dies with specialized functions are seamlessly integrated to deliver greater performance, flexibility, and efficiency. Advancing this frontier requires the development of innovative materials, manufacturing processes, equipment, and industry standards that will shape the next generation of semiconductor solutions.

Piedmont is home to a highly specialized industrial ecosystem where semiconductor design, advanced technologies, chiplet integration, System-in-Package, packaging and testing come together.

Through ALPIS, companies and technological expertise across the region are connected into an integrated semiconductor value chain, supporting the development of next-generation microelectronics solutions for Italy and Europe.

From Die Supply to Complete Heterogeneous Modules.