SPEA S.p.A.

SPEA is a technology company specializing in the design and manufacture of Automatic Test Equipment (ATE) for semiconductor devices, microelectromechanical systems (MEMS), power electronics, printed circuit boards, and complete electronic assemblies. Operating from its headquarters in Volpiano (Turin), the company handles the full development cycle of its testing hardware, proprietary software, and mechanical handling systems, providing test equipment used across wafer sorting, packaged device testing, board-level verification, and module validation.

Within the framework of the ALPIS consortium, SPEA contributes specialized test methodologies across the following key technology domains:

• Integrated Circuit Testing (Mixed-Signal Semiconductor ATE): Multi-core ATE architecture designed for volume manufacturing at wafer-level (wafer sorting) and package-level. The testers feature high-density pin channels capable of multi-site parallel testing across mixed-signal, analog, digital, and RF circuits to optimize test time and signal integrity.
• MEMS and Sensor Testing: Integrated test cells that combine high-precision electrical measurement with calibrated physical stimulus units and high-throughput pick&place handling. These platforms apply controlled mechanical motion, pressure, acoustic signals, magnetic fields, and environmental parameters within thermally conditioned environments to perform full functional verification and final sensor calibration.
• Power Electronics Testing: Specialized hardware architectures optimized for Silicon Carbide (SiC), Gallium Nitride (GaN), and Silicon power devices (at wafer level, known-good-die level, DBC, discrete and IGBT modules). The equipment performs both static parameter verification and dynamic switching analysis under high-voltage and high-current regimes, including partial discharge detection, stray inductance evaluation, and thermal stress testing.
• Electronic Board Testing: In-circuit, multi-domain test platforms for assembled printed circuit boards (PCBs). Utilizing both flying probe technology and bed-of-nails architectures, these testers perform parametric component measurements, optical test, functional verification, and boundary scan routines to verify the absence of defects at all levels.
• End-of-line Functional Testing (on complete devices): End-of-line functional test equipment designed to validate assembled electronic devices and multi-chip modules under final operating conditions. This includes structural and functional testing for end devices like touch displays, smartphones and tablets, HMI devices, operator panels, keyboards.

Through these capabilities, SPEA provides testing infrastructure applicable to automotive, industrial, consumer, power management, and aerospace electronics, supporting the technical objectives of the regional and European semiconductor ecosystem.