Asseltech S.r.l.

Asseltech is an Electronic Manufacturing Services (EMS) company specializing in the industrialization and manufacturing of advanced electronic assemblies and complete electronic systems for high-reliability applications.

Operating from its manufacturing facility in Rondissone (Turin), the company manages the entire industrialization cycle — from PCB engineering and DFM/DFT analysis through prototyping, SMT and THT assembly, inspection, testing, board protection, and final system integration — supporting both low-volume/high-mix production and recurring series manufacturing.

Within the framework of the ALPIS alliance, Asseltech contributes advanced electronics manufacturing, industrialization, and system integration capabilities across the following key technology domains:

• Advanced SMT Manufacturing and PCB Industrialization: Industrialization and assembly of complex printed circuit boards through three SMT production lines dedicated to prototyping, high-mix production, and series manufacturing. Manufacturing capabilities include 3D solder paste inspection (SPI), high-speed component placement, automated optical inspection (AOI), and digitally controlled reflow processes. Engineering activities include PCB layout support, Gerber file verification, panelization, DFM/DFT analysis, and manufacturing process definition, enabling the transition from electronic design and prototype to stable and repeatable industrial production.
• Vacuum Reflow and Power Electronics Assembly: Advanced in-line vacuum reflow technology for the assembly of power electronics and high-reliability PCBs, enabling controlled soldering processes and a significant reduction of voiding in thermally and electrically critical joints. These capabilities support electronic assemblies integrating Silicon Carbide (SiC), Gallium Nitride (GaN), and conventional silicon power devices for power conversion, e-mobility, energy, and industrial automation applications.
• Inspection, Testing and Manufacturing Process Validation: Integrated inspection and testing infrastructure covering the entire PCB assembly process, including 3D SPI, AOI, 100% in-line X-ray inspection, ICT, flying-probe testing, and functional testing. Automated X-ray inspection enables the verification of hidden solder joints and critical interconnections, while electrical and functional testing provides manufacturing process validation from component level through to the fully assembled electronic system.
• Controlled-Environment Manufacturing and High-Reliability Processes: Electronic manufacturing within a dedicated 600 m² ISO 8 cleanroom, combined with controlled cleaning and conformal coating processes for assemblies intended to operate in demanding environmental conditions. Automated cleaning, coating, and UV-LED curing technologies support contamination control and long-term protection against humidity and environmental stresses, supporting applications in the aerospace, automotive, railway, defense, medical, and industrial sectors.
• Digital Traceability and System Integration: Digitally integrated manufacturing processes linking material identification, component lots, production operations, inspection results, and test data throughout the entire product lifecycle. Automated material management, X-ray component counting, controlled storage, and ERP-connected production systems enable complete manufacturing process traceability. Complementary capabilities in custom cable manufacturing, electromechanical assembly, and final functional testing enable Asseltech to deliver complete electronic subsystems and finished assemblies.

Through these capabilities, Asseltech provides the ALPIS ecosystem with an integrated industrial capability able to transform advanced semiconductor-based technologies and electronic designs into qualified, repeatable, and fully traceable products, contributing PCB assembly, power electronics manufacturing, backend integration, and system-level industrialization capabilities to the regional and European semiconductor value chain.